Total
417 CVE
CVE | Vendors | Products | Updated | CVSS v2 | CVSS v3 |
---|---|---|---|---|---|
CVE-2019-2294 | 1 Qualcomm | 94 Mdm9205, Mdm9205 Firmware, Mdm9206 and 91 more | 2019-10-03 | 10.0 HIGH | 9.8 CRITICAL |
Usage of hard-coded magic number for calculating heap guard bytes can allow users to corrupt heap blocks without heap algorithm knowledge in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9205, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9655, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 | |||||
CVE-2019-2341 | 1 Qualcomm | 88 Mdm9150, Mdm9150 Firmware, Mdm9206 and 85 more | 2019-10-03 | 4.6 MEDIUM | 7.8 HIGH |
Buffer overflow when the audio buffer size provided by user is larger than the maximum allowable audio buffer size. in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24 | |||||
CVE-2019-2333 | 1 Qualcomm | 76 Mdm9150, Mdm9150 Firmware, Mdm9607 and 73 more | 2019-10-03 | 4.6 MEDIUM | 7.8 HIGH |
Buffer overflow due to improper validation of buffer size while IPA driver processing to perform read operation in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24 | |||||
CVE-2019-2252 | 1 Qualcomm | 72 Mdm9650, Mdm9650 Firmware, Msm8909w and 69 more | 2019-10-03 | 10.0 HIGH | 9.8 CRITICAL |
Classic buffer overflow vulnerability while playing the specific video whose Decode picture buffer size is more than 16 in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 | |||||
CVE-2018-5892 | 1 Qualcomm | 54 Mdm9206, Mdm9206 Firmware, Mdm9607 and 51 more | 2019-10-03 | 5.0 MEDIUM | 7.5 HIGH |
The Touch Pal application can collect user behavior data without awareness by the user in Snapdragon Mobile and Snapdragon Wear. | |||||
CVE-2018-11284 | 1 Qualcomm | 24 Mdm9206, Mdm9206 Firmware, Mdm9607 and 21 more | 2019-10-03 | 8.5 HIGH | 9.3 CRITICAL |
Spoofed SMS can be used to send a large number of messages to the device which will in turn initiate a flood of registration updates with the server in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 625, SD 636, SDA660, SDM630, SDM660, SDX20 | |||||
CVE-2018-11259 | 1 Qualcomm | 76 Mdm9206, Mdm9206 Firmware, Mdm9607 and 73 more | 2019-10-03 | 3.6 LOW | 7.7 HIGH |
Due to Improper Access Control of NAND-based EFS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, From fastboot on a NAND-based device, the EFS partition can be erased. Apps processor then has non-secure world full read/write access to the partition until the modem boots and configures the EFS partition addresses in its MPU partition. | |||||
CVE-2017-8274 | 1 Qualcomm | 24 Mdm9206, Mdm9206 Firmware, Mdm9607 and 21 more | 2019-10-03 | 10.0 HIGH | 9.8 CRITICAL |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, an access control vulnerability exists in Core. | |||||
CVE-2017-18071 | 1 Qualcomm | 24 Mdm9206, Mdm9206 Firmware, Mdm9607 and 21 more | 2019-10-03 | 10.0 HIGH | 9.8 CRITICAL |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, debug policy can potentially be bypassed. | |||||
CVE-2017-18299 | 1 Qualcomm | 38 Mdm9206, Mdm9206 Firmware, Mdm9607 and 35 more | 2019-10-03 | 4.9 MEDIUM | 5.5 MEDIUM |
Improper translation table consolidation logic leads to resource exhaustion and QSEE error in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660 | |||||
CVE-2017-18311 | 1 Qualcomm | 70 Mdm9607, Mdm9607 Firmware, Mdm9635m and 67 more | 2019-10-03 | 7.2 HIGH | 7.8 HIGH |
XPU Master privilege escalation is possible due to improper access control of unused configuration xPU ports where unused configuration ports are open in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. | |||||
CVE-2017-17773 | 1 Qualcomm | 58 Mdm9206, Mdm9206 Firmware, Mdm9607 and 55 more | 2019-10-03 | 10.0 HIGH | 9.8 CRITICAL |
In Snapdragon Automobile, Snapdragon Wearable and Snapdragon Mobile MDM9206,MDM9607,MDM9650,SD 210/SD 212/SD 205,SD 400,SD 410/12,SD 425,SD 430,SD 450,SD 600,SD 602A,SD 615/16/SD 415,SD 617,SD 625,SD 650/52,SD 800,SD 808,SD 810,SD 820,SD 820Am,SD 835,SD 845,MSM8909W, improper input validation in video_fmt_mp4r_process_atom_avc1() causes a potential buffer overflow. | |||||
CVE-2018-11257 | 1 Qualcomm | 10 Sd 205, Sd 205 Firmware, Sd 210 and 7 more | 2019-10-03 | 4.6 MEDIUM | 7.8 HIGH |
Permissions, Privileges, and Access Controls in TA in Snapdragon Mobile has an options that allows RPMB erase for secure devices in versions SD 210/SD 212/SD 205, SD 845, SD 850. | |||||
CVE-2018-5882 | 1 Qualcomm | 48 Mdm9206, Mdm9206 Firmware, Mdm9607 and 45 more | 2019-10-03 | 7.5 HIGH | 9.8 CRITICAL |
While parsing a Flac file with a corrupted comment block, a buffer over-read can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear. | |||||
CVE-2018-3588 | 1 Qualcomm | 22 Mdm9206, Mdm9206 Firmware, Mdm9607 and 19 more | 2019-10-03 | 7.2 HIGH | 7.8 HIGH |
There is improper access control of the SSC and GPU mapped regions which lead to inject code from HLOS in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 820, SD 820A, SD 835, SDA660. | |||||
CVE-2017-18276 | 1 Qualcomm | 18 Mdm9206, Mdm9206 Firmware, Mdm9607 and 15 more | 2019-10-03 | 7.2 HIGH | 7.8 HIGH |
Secure camera logic allows display/secure camera controllers to access HLOS memory during secure display or camera session in Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SD 845, SD 850 | |||||
CVE-2017-18313 | 1 Qualcomm | 20 Msm8909w, Msm8909w Firmware, Sd 205 and 17 more | 2019-10-03 | 5.7 MEDIUM | 5.3 MEDIUM |
Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617. | |||||
CVE-2018-3594 | 1 Qualcomm | 42 Mdm9206, Mdm9206 Firmware, Mdm9607 and 39 more | 2019-10-03 | 10.0 HIGH | 9.8 CRITICAL |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 820, SD 820A, SD 835, SD 845, while parsing a private frame in an ID3 tag, a buffer over-read can occur when comparing frame data with predefined owner identifier strings. | |||||
CVE-2017-18294 | 1 Qualcomm | 48 Fsm9055, Fsm9055 Firmware, Mdm9206 and 45 more | 2019-10-03 | 7.2 HIGH | 7.8 HIGH |
While reading file class type from ELF header, a buffer overread may happen if the ELF file size is less than the size of ELF64 header size in Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version FSM9055, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDA660, SDX20. | |||||
CVE-2017-18305 | 1 Qualcomm | 14 Mdm9206, Mdm9206 Firmware, Mdm9607 and 11 more | 2019-10-03 | 6.9 MEDIUM | 7.0 HIGH |
XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835. |