CVE-2023-33023

{"id": "CVE-2023-33023", "cveTags": [], "metrics": {"cvssMetricV31": [{"type": "Primary", "source": "product-security@qualcomm.com", "cvssData": {"scope": "UNCHANGED", "version": "3.1", "baseScore": 8.4, "attackVector": "LOCAL", "baseSeverity": "HIGH", "vectorString": "CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H", "integrityImpact": "HIGH", "userInteraction": "NONE", "attackComplexity": "LOW", "availabilityImpact": "HIGH", "privilegesRequired": "NONE", "confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 2.5}]}, "published": "2024-04-01T15:15:46.793", "references": [{"url": "https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2024-bulletin.html", "source": "product-security@qualcomm.com"}], "vulnStatus": "Awaiting Analysis", "weaknesses": [{"type": "Secondary", "source": "product-security@qualcomm.com", "description": [{"lang": "en", "value": "CWE-120"}]}], "descriptions": [{"lang": "en", "value": "Memory corruption while processing finish_sign command to pass a rsp buffer."}, {"lang": "es", "value": "Corrupci\u00f3n de la memoria al procesar el comando Finish_sign para pasar un b\u00fafer rsp."}], "lastModified": "2024-04-12T09:15:08.740", "sourceIdentifier": "product-security@qualcomm.com"}